Design of Microstrip Patch Antenna for Dual-band Operation using Metal Ring Superstrate
Chandrashekar K S1, Chandramma S2, Halappa Gajera3, Koushik Dutta4
1Chandrashekar K. S*, Dept. of Electronics, Yuvaraja’s College, Mysuru, India.
2Chandramma S, Dept. of Electronics, Yuvaraja’s College, Mysuru, India.
3Halappa Gajera, Dept. of Studies in Electronics, PG Centre, University of Mysore, Hassan, Karnataka, India.
4Koushik Dutta, Dept. of Electronics & Comm. Engineering, Netaji Subhash Engineering College, Kolkata, India.
Manuscript received on January 05, 2020. | Revised Manuscript received on January 25, 2020. | Manuscript published on January 30, 2020. | PP: 4538-4543 | Volume-8 Issue-5, January 2020. | Retrieval Number: E6870018520/2020©BEIESP | DOI: 10.35940/ijrte.E6870.018520
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© The Authors. Blue Eyes Intelligence Engineering and Sciences Publication (BEIESP). This is an open access article under the CC-BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/)
Abstract: In this paper, a dual-band generation in rectangular microstrip patch antenna (RMPA) using a superstrate metal ring has been proposed. In this configuration, a metal ring is placed above the rectangular patch with the support of two dielectric posts. The metal ring behaves as a superstrate layer and resonator for the lower band, the other band is generated by microstrip patch and hence the combined configuration metal ring and patch gives dual-band characteristics. The lower band resonates at 9 GHz with an impedance bandwidth of 6.8% and higher band at 11.35 GHz with impedance bandwidth of 3.1%. The co-polarized peak gain values at these frequencies are 8.2 dBi and 10.1 dBi respectively. This may be used in applications like airborne and naval-radar. The prototypes are fabricated using commercially available dielectric substrate (RT-Duriod r = 2.2 and thickness h =1.6 mm). The measured results show good agreement with the simulated predictions.
Keywords: Dual-Band, Microstrip Patch Antenna, Metal Ring, Superstrate.
Scope of the Article: Optical Link Design.