The Making of Particleboard from Palm Oil Fiber and Dust Wood with Epoxy as a Resin
Siti Norzailina Md Som1, M.N.M. Baharuddin2, Norazwani Muhammad Zain3, M.R.Shaari4
1NSiti Norzailina binti Md Som*, Politeknik Sultan Haji Ahmad Shah, Kuantan Pahang, Malaysia.
2M.N.M.Baharuddin, Kolej Kemahiran Tinggi MARA, Petaling Jaya No. 12 Jalan Templer Petaling Jaya, Selangor, Malaysia.
3Norazwani Muhammad Zain, Universiti Kuala Lumpur Malaysia France Institute, Bandar Baru Bangi, Selangor, Malaysia.
4Mohd Rosmaini Bin Shaari Kolej Kemahiran Tinggi MARA, Kemaman.
Manuscript received on November 11, 2019. | Revised Manuscript received on November 20 2019. | Manuscript published on 30 November, 2019. | PP: 11016-11019 | Volume-8 Issue-4, November 2019. | Retrieval Number: D5420118419/2019©BEIESP | DOI: 10.35940/ijrte.D5420.118419
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© The Authors. Blue Eyes Intelligence Engineering and Sciences Publication (BEIESP). This is an open access article under the CC-BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/)
Abstract: Particleboard has been widely used in producing products such as cabinets, furniture and various home use products. In this study, epoxy resin has been used as a binder for replacing urea-formaldehyde (UF) resin which is widely used in the production of existing particleboards. Epoxy resin has strong binding properties in composing composite materials. Epoxy resin also does not release any gas as carcinogenic formaldehyde released by UF resin. The basic materials used in the production of this particleboard are palm oil fiber obtained from the Charuk Putting Palm Plant, Temerloh and dust wood obtained from the timber factory around Kuantan. The main purpose of the research scientifically known is to reduce the forest logging activities in addition to utilizing waste materials. There are 2 different size of particle material used in this study which are < 2.36mm (particle A) and 2.36mm < x < 4.75mm (particle B). The particleboard that has been produced was tested ith Universal Tensile Machine (UTM) for looking to the Modulus of Elasticity (MOE) and thickness swelling (TS). From the result, it shown that the value of Modulus of Elasticity (MOE) for particle A was 16,364 MPa while particle B was 35,578 MPa. The value of thickness swelling (TS) for particle A was 0% when it immersed for 2 hours compared o particle B which was 1.7% in the same duration. As a result of experiments, all tests have passed the minimum level of particleboard based on the Japanese Industrial Standard (JIS), 2003. Therefore, particleboard of a mixture of palm oil fiber and dust wood with epoxy as a resin can be used as a new alternative in the production particleboard for furniture industry in the future. Keywords:
Keywords: Homogeneous Particle Board, Palm oil Fiber.
Scope of the Article: Decision Making.