Analysis of U shaped MEMS Micro cantilever using COMSOL
K. Durga Aparna1, N.Amarnath2

1K. Durga Aparna, DST, Women scientist.
2N.Amarnath, Lecturer, Department of IT, Salalah College of Technology, Salalah, Oman.
Manuscript received on March 12, 2020. | Revised Manuscript received on March 25, 2020. | Manuscript published on March 30, 2020. | PP: 2860-2861 | Volume-8 Issue-6, March 2020. | Retrieval Number: F7453038620/2020©BEIESP | DOI: 10.35940/ijrte.F7453.038620

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Abstract: This paper explains about analysis of U shaped MEMS cantilever with silicon substrate using COMSOL Multiphysics software. This U shape cantilever structure is made of silicon and on that different layers are incorporated. U shape cantilever will have high beam length and this design can meet any requirements with allowable strain limits.
Keywords: MEMS, COMSOL, Simulation, U shape.
Scope of the Article: Structural Reliability Analysis.