Simulation of Electronics Cooling Deploying Water-Zinc Oxide Nanofluid
N. K. Kund
N. K. Kund, Department of Production Engineering, Veer Surendra Sai University of Technology, Burla, (Odisha), India.
Manuscript received on 23 March 2019 | Revised Manuscript received on 30 March 2019 | Manuscript published on 30 March 2019 | PP: 1076-1078 | Volume-7 Issue-6, March 2019 | Retrieval Number: F2696037619/19©BEIESP
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© The Authors. Blue Eyes Intelligence Engineering and Sciences Publication (BEIESP). This is an open access article under the CC-BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/)
Abstract: Research work involves mass, momentum as well as energy balances for computing electronics cooling level. 2D computational model of integrated circuit segment is established for examining thermal issues by means of water-zinc oxide (ZnO) nanofluid coolant. Computational modeling encompasses other significant terms such as inertia, viscidness, gravity in addition to thermal buoyancy influences in spite of common concerns vis-à-vis present somatic problem. However, this model oversees both compressibility as well as viscous dissipation paraphernalia. Computational model is excellently established for the same with integrated circuit segment heat transfer/area of 70 W/cm2 other than thermophysical properties of nanoparticle in addition to model data as vivacious considerations. Finally, the model outcomes are also alongside the expected lines. For comparison a pilot scale experimental preparation is underway due to nonexistence of related model in the texts. This is perceived that water-zinc oxide (ZnO) nanofluid gives proper cooling without any thermal disaster by keeping integrated circuit segment temperature pretty below safety bound.
Keywords: Integrated circuit, Computational, Cooling, Water-zinc oxide (ZnO), Nanofluid.
Scope of the Article: Nano electronics and Quantum Computing