Design and Development of Aluminum-based Heat Sink for Electronic Gadgets
Krishnamoorthy1, T. Jayakumar2

1Krishnamoorthy, PG Student, Department of Mechanical Engineering, Kavery College of Engineering, Salem (Tamil Nadu), India.
2T. Jayakumar, Assistant Professor, Department of Mechanical Engineering, AMET Deemed University, Chennai (Tamil Nadu), India.
Manuscript received on 22 April 2019 | Revised Manuscript received on 01 May 2019 | Manuscript Published on 08 May 2019 | PP: 7-10 | Volume-7 Issue-5S3 February 2019 | Retrieval Number: E11010275S19/19©BEIESP
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Abstract: The aim of the present study to investigate the optimum weight and maximum heat dissipation of the heat sink. The materials and fin design as a two-major factor to increase the heat dissipation from the electronic chip. Show 3D analysis is verified with accessible exploratory information in the existing data for a continues finned heat sink. To identify the heat dissipation and mean temperature distribution of the heat sink for natural convection. Results reveal that the 6063 aluminum alloys with case II fin design have maximum heat dissipation of the heat sink compared to 6061, 7071 alloys. The heat dissipation of heat sink case II fin design is greater than the case I fin design under all the material condition, due to the airflow of the design. The mass of the case 1 fin design is lesser than the case II fin design. In addition to, the case I fins increase the heat transfer rate and have a higher weight than regular case II fin design. Moreover, it was concluded that case II fin design has the lowest temperature without raising the weight of the heat sink, which implies that the better performance in comparison to the other designs.
Keywords: Heat Sink, Aluminum, Heat Dissipation, Heat Flux, Natural Convection, Radiation.
Scope of the Article: Heat Transfer