The Development of Low-Temperature Lead-Free Solders using Sn-Bi Solders Alloys
M. S. Hashim1, O. Saliza Azlina2, M. N. Ervina Efzan3
1M. S. Hashim, Faculty of Mechanical Engineering and Manufacturing at the University Tun Hussein Onn Malaysia.
2O. Saliza Azlina, Faculty of Mechanical & Manufacturing Engineering, University Tun Hussein Onn Malaysia
3M. N. Ervina Efzan, Deputy Director, Research Management Centre, Multimedia University, Malaysia.

Manuscript received on November 17., 2019. | Revised Manuscript received on November 24 2019. | Manuscript published on 30 November, 2019. | PP: 11956-11962 | Volume-8 Issue-4, November 2019. | Retrieval Number: D9913118419/2019©BEIESP | DOI: 10.35940/ijrte.D9913.118419

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Abstract: Lead-free solders have been the substructure innovation of electronic interconnections for many decenniums due to the widespread utilization of electronic contrivances. Sn-Ag–Cu (SAC) is presently seen as the popular lead-free solder alloy for bundling interconnects in the electronics industry. In this review, the study on the development of low-temperature Pb-free solders using Sn-Bi solder alloys will be discussed regarding thermal behaviour and wettability. The impact of alloying on these compounds is depicted as far as basic microstructural changes, mechanical properties, and reliability. The review closes with a perspective for cutting edge electronic interconnect materials.
Keywords: SAC, Sn-Bi, Intermetallic Compound, Lead-Free Solder.
Scope of the Article: Mobile App Design and Development.