Synthesis of Mo-Cu Nanoalloys and Computer Aided Thermal Analysis of Mo-Cu Nanoalloys Based Heat Sink
Guda Rajesh Kumar1, D. Kondayya2
1Guda Rajesh Kumar, M. Tech. Scholar, Department of Mechanical Engineering, Sreenidhi Institute of Science and Technology, Ghatkesar, Hyderabad, Telangana.
2D. Kondayya Professor, Department of Mechanical Engineering, Sreenidhu Institute of Science and Technology, Ghatkesar, Hyderabad, Telangana.
Manuscript received on 05 August 2019. | Revised Manuscript received on 11 August 2019. | Manuscript published on 30 September 2019. | PP: 7872-7875 | Volume-8 Issue-3 September 2019 | Retrieval Number: C6557098319/2019©BEIESP | DOI: 10.35940/ijrte.C6557.098319
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© The Authors. Blue Eyes Intelligence Engineering and Sciences Publication (BEIESP). This is an open access article under the CC-BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/)
Abstract: Mo-Cu alloys are used as heat sinks, microwave absorbers in microelectronic devices and as electric contacts in circuit breakers. Mo-Cu nanoalloys with average sizes below 200 nm were prepared using molybdenum powder and copper nitrate. Compositional characterization of Mo-Cu alloys was carried out using portable XRF. The developed material i.e. Mo-Cu is used as heat sink application in which the heat sink is modeled and thermally analyzed for evaluation of heat flux. The heat flux obtained was compared with heat sink made of aluminum. It was observed that the Mo-Cu heat sink exhibited superiority in withstanding higher temperature whereas, heat sink designed from aluminum was limited with their parameter which is thermal conductivity.
Keywords: Copper (Cu), Molybdenum (Mo), Spark plasma sintering (SPS), Three-Dimensional (3D), Two-Dimensional (2D).
Scope of the Article: Computer Network