Prevention of Defects in Injection Molding Process in the Manufacturing of Ballpoint Pen
Mahesh Naik R1, P B Shetty2, Kotgi Kotresh3, Avinash L4
1Mahesh Naik R, Pursuing M. Tech in Machine Design from Nitte Meenakshi institute of Technology, Bangalore.
2P B Shetty, Professor in the Department of Mechanical Engineering in Nitte Meenakshi Institute of Technology, Bangalore.
3Kotgi Kotresh, Assistant Professor in Department of Mechanical Engineering at Nitte Meenakshi Institute of Technology, Bangalore.
4Avinash L, Professor in Department of Mechanical Engineering, Nitte Meenakshi Institute of Technology Karnataka, Bengaluru, India.
Manuscript received on 01 August 2019. | Revised Manuscript received on 06 August 2019. | Manuscript published on 30 September 2019. | PP: 4932-4837 | Volume-8 Issue-3 September 2019 | Retrieval Number: C5590098319/2019©BEIESP | DOI: 10.35940/ijrte.C5590.098319
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© The Authors. Blue Eyes Intelligence Engineering and Sciences Publication (BEIESP). This is an open access article under the CC-BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/)
Abstract: Injection molding is one of the major manufacturing processes for thermoplastic polymers. In injection molding machine, process variables play a very important role in generating defects in products. In the present paper manufacturing of ball point pen is taken up to investigate the prevention of defects through design and controlling various process parameters. Two molds are designed and fabricated specially for this experimental work. The analysis showed that the defect occurrence has close relation with pressure, speed and the temperature of the injection molding machine in addition to the basic design of the mold. The paper suggests preventive actions for the defects like flash, burn marks, short shot, shrinkage, weld line, warpage and sink mark. The preventive actions were successfully implemented in manufacturing the ball point pen.
Keywords: Injection Molding, Ball Point Pen, Mold Defect, Preventive Action.
Scope of the Article: Process & Device Technologies