Reduction of Signal Integrity Issues in Printed Circuit Board Using Electromagnetics Bandgap Structure
Fahad Bilal1, Manisha Bansode2, Pramod Bhavar the3, Surendra Rathod4
1Fahad Bilal, Department of EXTC Engg., SPIT, Mumbai, India.
2Manisha Bansode, Department of Electronics Engg., SPIT, Mumbai, India.
3Pramod Bhavar the, Department of EXTC Engg., PVPPCOE, Mumbai, India.
4Surendra Rathod, Department of Electronics Engg., SPIT, Mumbai, India.

Manuscript received on 01 April 2019 | Revised Manuscript received on 06 May 2019 | Manuscript published on 30 May 2019 | PP: 3471-3474 | Volume-8 Issue-1, May 2019 | Retrieval Number: A3056058119 /19©BEIESP
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Abstract: These day’s electronic devices operate on the GHz frequency which requires a high-speed circuit. Due to high-speed data transfer, there are lot of signal integrity issues induce in circuit. Electromagnetic Bandgap Structure is used to reduce the signal integrity issues. In this paper, two dimensional electro- magnetic bandgap structure is proposed for noise mitigation in printed circuit board. Results confirms the reliability of 2D EBG for noise mitigation and the upgrade in the signal quality. Results are interms of transmission parameter S21 -86.49 dB, surface current Distribution and have the bandwidth of 1.48 GHz.
Index Terms: Printed Circuit Board (PCB), Signal In- Tegrity (SI), Electromagnetic Band- Gap (EBG) Structure
Scope of the Article: Mobile System Integrity, Security, and Fault Tolerance