Thermal Analysis of Semi Circular Pin Fins f or Application i n Electronics Cooling
Saroj Yadav1, Kumari Ambe Verma2, Mukul Ray3, Krishna Murari Pandey4
1Saroj Yadav, Research Scholar, Department of Mechanical Engineering, National Institute of Technology, Silchar, Assam, India.
2Kumari Ambe Verma, Research Scholar, Department of Mechanical Engineering, National Institute of Technology, Silchar, Assam, India.
3Mukul Ray, Public Works Department, Government of Tripura, Agartala- 799006, India.
4Krishna Murari Pandey, Professor, Department of Mechanical Engineering, National Institute of Technology, Silchar, Assam, India.
Manuscript received on 11 March 2019 | Revised Manuscript received on 20 March 2019 | Manuscript published on 30 July 2019 | PP: 2366-2374 | Volume-8 Issue-2, July 2019 | Retrieval Number: A1954058119/19©BEIESP | DOI: 10.35940/ijrte.A1954.078219
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© The Authors. Blue Eyes Intelligence Engineering and Sciences Publication (BEIESP). This is an open access article under the CC-BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/)
Abstract: Efficient thermal energy management of a system is always a prime requirement for many equipment and industries. The performance of almost all devices are affected by the thermal conditions of the system, which also include the surroundings. Generation of heat is an unavoidable phenomenon for any device that runs on external power sources. The generated heat in such systems must be dissipated to the surrounding. It requires efficient utilization of the surface area with minimum flow losses in the system. It was always desirable to have a heat sink in the all devices that occupy minimum space with maximum effectiveness. The present work is an effort to analyze conjugate heat transfer physics in a 3-D system of aluminum pin fins, with air as the working fluid. A finite element solver, COMSOL 4.3a has been used in simulating a staggered pin fin arrangements placed over a base plate. The solver is validated using the empirical data of previous literature. The thermal analysis has been performed on semicircular pin fins with uniform cross section. Consideration is given to staggered arrangement of semicircular fins with various relative distances between two sections of a circle with various inlet velocities. Heat transfer coefficient, Nusselt number, skin friction coefficient and pressure coefficient are four parameters that are taken into consideration for analyzing all the fin geometries in the current study. The proposed shapes are designed to increase the wetted surface area by keeping the fin material volume constant.
Keywords: Extended Surfaces; Nusselt Number; Heat Transfer co-Efficient; Finite Element Method; Conjugate Heat Transfer.
Scope of the Article: Nano Electronics and Quantum Computing