Investigation and Simulation of Mechanical Properties of W &Al2O3 Thin Films Co-Sputtered on SS304 Substrates
Naveen A1, L Krishnamurthy2, T N Shridhar3

1Naveen A, Department of Mechanical Engineering, Vidyavardhaka College of Engineering, VTU, Mysuru (Karnataka), India.
2Dr. L Krishnamurthy, Department of Mechanical Engineering, The National Institute of Engineering, Mysuru (Karnataka), India.
3Dr. T N Shridhar, Department of Mechanical Engineering, The National Institute of Engineering, Mysuru (Karnataka), India.
Manuscript received on 20 May 2019 | Revised Manuscript received on 06 June 2019 | Manuscript Published on 15 June 2019 | PP: 150-153 | Volume-8 Issue-1S2 May 2019 | Retrieval Number: A00320581S219/2019©BEIESP
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Abstract: Tungsten (W) and Alumina (Al2O3 ) thin films developed on SS304 substrates have been made under various deposition conditions of magnetron co-sputtering. Deposition Conditions have been defined using the DOE approach. Measured thicknesses of films have been ranges from 130.5 nm to 445nm. Thin films have assessed by means of mechanical properties viz., Young’s modulus (E) and hardness (H). Assessment has been done by using the nanoindentation experiment and the numerical simulations. Nanoindentation experiment has been conducted for five different thickness’s values. These results were processed to simulate for remaining deposition conditions in order to achieve more information. Experimental results and simulated values have been summarized as a final opinion. Based on these results, best E and H mechanical properties have been selected to present optimum condition. Optimum condition has been found for thin film thickness 419 nm.
Keywords: Co-sputtering, Nanoindentation, Tungsten and Alumina Thin Film, Young’s Modulus and Hardness.
Scope of the Article: Mechanical Design